flip chip bonding meaning in Chinese

倒装焊接
倒装片接合

Flip chip bonding technology used in modern micro - photoelectron package
现代微光电子封装中的倒装焊技术
In this thesis , the work on automatic alignment system is as follows : firstly , after the methods and optical systems for alignment whose are used commonly now are discussed , a new die leveling method based on auto - focus is presented for the flip chip bonder . auto - focus is completed by estimating from images ; die leveling is completed by focusing for several feature locations
本文针对倒装贴片机的自动对准系统开展了以下几方面的工作:首先在讨论了现有的对准方法和自动贴片机的对准光路系统基础上,针对贴片机实际应用环境,提出基于多点自动对焦的芯片调平方法。
An automatic flip chip bonder is a precision instrument used to align and bond one or more dies onto a substrate in semiconductor industry . it develops for the mass production of ic , mems and moems with small feature sizes and high precise bonding demands . an alignment system is one of the key components in flip chip bonders
全自动倒装贴片机( flipchipbonder )是半导体生产工艺中完成芯片和基底对准、键合的高精度自动化设备,适合于特征尺寸小,键合精度要求高的ic ( integratedcircuit ) 、 mems ( microelectromechanicalsystem ) 、 moems ( microopticalelectromechanicalsystems )等的大规模生产。